SICE reaffirms the role of the academic society as a hub of industry and academia. We want to make SICE a place where corporate engineers and university researchers want to gather. Under the initiative of ”SICE Industry,“ we will promote open innovation to fill the gap between industry and academia. Here we introduce events and sessions recommended for participants from the industrial sector.
What’s SICE Industry?
The driving force behind this initiative is to narrow the gap between academia and companies, and to expand SICE’s contribution to solving social issues. We aim to revitalize the industrial sector in SICE and to directly contribute to industry. By doing so, we aim to provide a place for research activities, information sharing, and human resource co-creation to solve social issues based on the foundation of measurement and control technology. SICE Industry is promoted by the SICE Industry Committee.
JEMIMA Special Talk
Michael Hoffmeister
Directors – Industrial Digital Twin Association, Chairman of IEC TC65/WG24 “AAS”, Hochschule Karlsruhe University of Applied Sciences Faculty of Mechanical Engineering and Mechatronics
Solving the interoperability puzzle – A technical view of the Asset Administration Shell
Schedule:To be confirmed
Location:To be confirmed
Abstract: This lecture presentation provides an overview of the scope, use cases, standardization and technical background of the Asset Administration Shell (AAS), which is an approach of an interoperable digital twin in the fields of smart manufacturing and beyond. In the standardization part, the relation to IEC 61987 (list of properties), IEC 62832 (digital factory) (see the SICE2023 presentation about digital factory), IEC 61406 (identification link) and IEC 63278 (AAS) will be described and the use organization IDTA (industrial digital twin association) will be introduced. Typical use cases of the AAS are provided, before a technical overview of the AAS meta model and tool chain is given, including authoring and repository tools (AASX Package Explorer and AASX Server). Finally, interfacing with IEC 62541 (OPC UA) is covered as well as the approach of industrial data spaces in value chains.
Biography: Michael Hoffmeister is a professor for intelligent automation in the field of mechatronics at the technical university of Karlsruhe. He is also in the board of directors of the Industrial Digital Twin Association (IDTA) and is the convenor of the IEC 63278 international standard on the Asset Administration Shell. He is a well-known speaker and trainer on national and international conferences on smart manufacturing, industry 4.0 technologies and industrial automation. Michael started his career with the Karlsruhe Institute of Technology (KIT), receiving a diploma in computer science while working as a free-lance engineer for electronics and real-time embedded systems. He moved on to Fraunhofer IPA (institute for production technology and automation) in Stuttgart. He received his PhD in mechanical engineering in the fields of intelligent automation with semantic task descriptions. Following his PhD, Michael changed to Festo in Esslingen, an international renown supplier for factory and process automation. With Festo, he executed corporate projects for the digitalization of the product range and digital twin technology. He represented the company in the fields of Plattform Industrie 4.0 and got active in many associations working groups, including heading the ZVEI working group SG2 for the I4.0 component, becoming the Asset Administration Shell. He is one of the main architects of this approach, representing it in many national and international activities in smart manufacturing. As part of these activities, he became member of ISO and IEC working groups on smart manufacturing, e.g. the ISO/ IEC joint working group 21 for unified reference model on smart manufacturing.
Michaels current interest lies on teaching and research activities on intelligent automation. He is the head of the working group Submodels for the Industrial Digital Twin Association (IDTA), which is the umbrella organization for more than 100 Submodel standardization working groups. He is the main author of the AASX Package Explorer, which provides a tool chain for developing and publishing these technical standards. He heads the IEC TC65 working group 24 for the IEC 63278 standard series. IEC 63278-1 is already published as international standard, while the working groups progresses with 4 further parts, leading to a fully specified, international standard for interoperable digital twins.